The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...

Heat management at the nanoscale has long been a cornerstone of advanced technological applications, ranging from high-performance electronics to quantum computing. Addressing this critical challenge, ...

The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

With digital twins (virtual replicas of objects or systems) of capacitors, engineers can simulate system-level interactions ...

As the semiconductor industry traverses through the deep-submicron process nodes, each plateau along the way carries its own signature bugaboo arising from physical effects. At 180 nm, timing-closure ...